TEC1-12706 Heatsink Thermoelectric Cooler Peltier Cooling Plate

Product model: TEC1-12706
Logarithmic 127 appearance size 40 X 40 components
Standard tin lead conductor, PVC insulated skin, 125 plus or minus 2 mm long, lead wire end skinning 7 plus or minus 1 mm wire welding one end on the hot surface.
1.95 ~ 2.15 Ω resistance (23 + / - 1 ℃, environment temperature 1 KHZ Ac test)
The largest temperature difference delta Tmax (Qc = 0) 67 ℃
When working current Imax 12 VDC 4.7 A, 6.3 A 15.4 VDC
Vmax maximum voltage 15.4 VDC
Maximum refrigerating power Qcmax 56 w (15.4 VDC)
The assembly pressure of 98 n/cm2

An overview, principle

You know when the CPU working temperature is lower, the better.Many articles about CPU heat dissipation is good overclocking is one of the key success factors.

Generally by using large fans, such as thermal conductive silicone coating to improve the CPU cooling conditions, but these methods can make the temperature of the CPU below room temperature.


Here when it comes to the semiconductor refrigeration device is based on the characteristics of thermoelectric technology, the use of special semiconductor thermopile refrigerating, can convert electrical energy directly to heat, high efficiency.

General CPU heat power is less than 30W, and the power of the cooler than 50 w, if heat dissipation is good, it is possible to make the CPU work under close to 0 ℃ and 0 ℃.


Semiconductor refrigerating unit USES a lot of, can be used for the production of portable refrigeration/heat preservation box, hot and cold water dispenser, etc.Also used for cooling of electronic devices.

The refrigerating unit used by the semiconductor material is the most main is bismuth telluride, joined the impurity content through special processing and into N or P type semiconductor thermoelectric elements.

Common market TEC1-12605, for example, its rated voltage: 12 v, rated current is 5 a, the maximum temperature difference of up to 65 degrees Celsius, installation dimensions for 4 X 4 X 0.4 Cm, weighs about 25 grams.Its characteristics is as refrigeration and heating.


After connected to a dc power supply, electronic by the cathode (-), the first after a p-type semiconductor, in the absorption of heat, the N type semiconductor, heat rejection, it will every NP module, have heat was sent to the other side by side, caused by temperature difference, thus forming the hot and cold end.

Package includes:

1 X TEC1-12706 Heatsink Thermoelectric Cooler Peltier Cooling Plate

Note: all the descriptions and prices are subject to change without prior notice.

Free Shipping: No

Shipping Weight/Unit(g): 25.00

Std. Packing Qty. (pcs): 1

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